Silicon Valley-based SuVolta Inc said it was able to raise $10.6 million in funding. A semiconductor firm, SuVolta develops and licenses scalable technologies focused on low-power, high-performance integrated circuits. The company has a reputation of advancing the semiconductor industry through by developing technology and innovation.
The latest funding round was participated in by new investor Fujitsu Semiconductor Limited. Existing investors Kleiner Perkins Caufield & Byers (KPCB), August Capital, New Enterprise Associates (NEA), Northgate Capital and DAG Ventures also gave their support to the semiconductor firm.
SuVolta said the proceeds from the round will be used to enable the company to integrate its low-power chip technology into the design and making of semiconductor integrated circuits or ICs to be used in ultra-low power applications at a much faster pace. The applications include DRAM, Internet of Things (IoT) and mobile computing, SuVolta said.
In a statement, SuVolta Board member and NEA General Partner Forest Baskett said the semiconductor industry's greatest challenges as the world becomes increasingly connected are reducing power consumption and controlling costs. He added that SuVolta is coming up with solutions to these even as it improves planar, bulk CMOS or Complementary metal oxide semiconductor which he said is the most cost-effective process technology of the industry. The technology is important for the emerging Internet of Things market, Baskett added.
By using planar, bulk CMOS, SuVolta said its technology gives substantial improvements in the power performance to various CMOS-based logic ICs.
SuVolta President and Chief Executive Officer Bruce McWilliams said in the statement, "This funding demonstrates the excitement surrounding our technology and the benefits it can bring large markets such as DRAM, IoT and mobile computing. With DDC technology now in volume production, we are seeing increased interest from leading foundries and semiconductor companies seeking a competitive advantage through ultra-low-power optimization."
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