The Advanced Semiconductor Engineering Group broke ground for new facilities to be built in Southern Taiwan,. The world's biggest computer chip packaging and testing firm's new factories would offer 3,500 new jobs and create US$350 million in revenues annually.
There would be two new buildings constructed at the Kaohsiung Nantze Export Processing Zone to operate the advanced packaging processes including its centers for research and development. Another building was constructed last year where semiconductor packaging facilities are currently housed. There are other buildings to be completed by the third quarter of 2014.
According to ASE Chairman Jason Chang, the ceremony is part of the company's short term investment plans and its long term goals would be to continue investing into the country well into the next decade. The total investments are projected to be between US$3billion and US$4billion.
This is a clear commitment by the company to Taiwan, as the country continues its goal to remain as the top country for semiconductor packaging and testing.
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